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10 Layer Rigid Printed Circuit Board With Tg150 FR4 OSP+ Golden Finger Technology
  • 10 Layer Rigid Printed Circuit Board With Tg150 FR4 OSP+ Golden Finger Technology

10 Layer Rigid Printed Circuit Board With Tg150 FR4 OSP+ Golden Finger Technology

Orzecznictwo ISO9001, TS16949
Szczegóły Produktu
Przedmiot:
Niestandardowa płyta obwodu 10 warstw
Gruby miedzi:
1 un do każdej warstwy
Grubość tablicy:
FR4 TG150 1,6 mm
Usługa PCBA:
Zespół komponentów SMD SMT DIP
Technologia:
Impendace Control, Golder Finger+ Bevel
Minimalna przestrzeń między wierszami:
3 mil (0,075 mm)
Minimalny rozmiar otworu:
0,2 mm
Rozmiar otworu min:
0,2 mm
Warunki płatności i wysyłki
Minimalne zamówienie
1 panel
Cena
Negocjowalne
Szczegóły pakowania
Pakiet próżniowy
Czas dostawy
1-2 tygodnie
Zasady płatności
T/t
Opis produktu

Product Description:

A 10-layer, 1 oz rigid PCB is a high-performance circuit board with 10 conductive copper layers and a standard copper thickness of 1 ounce on each layer. This type of board is used in advanced electronics where high density, reliability, and signal integrity are essential.

The term "10-layer" refers to the number of conductive copper layers. These layers are stacked and separated by insulating materials (dielectrics) like FR-4 (fiberglass-epoxy laminate). The stack-up of these layers is carefully designed to optimize performance. A typical configuration might include: 
Signal Layers: These layers carry data and signals between components. With 10 layers, designers have ample space to route complex circuits, reducing signal congestion and allowing for high-density component placement.
Power and Ground Planes: Dedicated layers for power and ground provide a stable and low-impedance path for current, which is crucial for high-speed digital circuits. They also act as a shield to minimize electromagnetic interference (EMI) and help with heat dissipation.


Technical Parameters:

Product item 10 layer rigid PCB board
Board Thickness FR4 Tg150 1.6mm 
Processing Technology Impendace control, golden finger
Solder Mask Color Geen soldermask+ white silkscreen
Standard Testing IPC Class 2
Minimum Hole Size 0.2mm
Pcba Service SMD SMT DIP Component Assembly
Minimum Line Space 3mil (0.075mm)
Min Hole Size 0.2MM



Support and Services:

Our Product Technical Support and Services for the Heavy Copper PCB include:

- Expert consultation on design and manufacturing considerations

- Assistance with material selection and specifications

- Guidance on meeting industry standards and regulations

- Troubleshooting and resolution of technical issues

- Customization options to meet specific requirements

Skontaktuj się z nami w dowolnym momencie

86-153-8898-3110
Pokój 401, budynek nr 5, park technologiczny Dingfeng, społeczność Shayi, miasto Shajing, dystrykt Bao'an, Shenzhen, prowincja Guangdong, Chiny
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